Electrical - An Introduction to Electronics System Packaging (English)

   Monday, March 17, 2025   

Starting a new Lecture Notes Series on Electrical - An Introduction to Electronics System Packaging

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Lecture 1: Mod-01 Lec-01 Introduction and Objectives of the course

Lecture 2: Mod-01 Lec-02 Definition of a system and history of semiconductors

Lecture 3: Mod-01 Lec-03 Products and levels of packaging

Lecture 4: Mod-01 Lec-04 Packaging aspects of handheld products; Case studies in applications

Lecture 5: Mod-01 Lec-05 Case Study (continued); Definition of PWB, summary and Questions for review

Lecture 6: Mod-02 Lec-06 Basics of Semiconductor and Process flowchart; Video on "Sand-to-Silicon"

Lecture 7: Mod-02 Lec-07 Wafer fabrication, inspection and testing

Lecture 8: Mod-02 Lec-08 Wafer packaging; Packaging evolution; Chip connection choices

Lecture 9: Mod-02 Lec-09 Wire bonding, TAB and flipchip-1

Lecture 10: Mod-02 Lec-10 Wire bonding, TAB and flipchip-2; Tutorials

Lecture 11: Mod-03 Lec-11 Why packaging? & Single chip packages or modules (SCM)

Lecture 12: Mod-03 Lec-12 Commonly used packages and advanced packages; Materials in packages

Lecture 13: Mod-03 Lec-13 Advances packages (cont),Thermal mismatch in packages,Current trends in packaging

Lecture 14: Mod-03 Lec-14 Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps

Lecture 15: Mod-04 Lec-15 Electrical Issues -- I; Resistive Parasitic

Lecture 16: Mod-04 Lec-16 Electrical Issues -- II; Capacitive and Inductive Parasitic

Lecture 17: Mod-04 Lec-17 Electrical Issues -- III; Layout guidelines and the Reflection problem

Lecture 18: Mod-04 Lec-18 Electrical Issues -- IV; Interconnection

Lecture 19: Mod-05 Lec-19 Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT

Lecture 20: Mod-05 Lec-20 Components of a CAD package and its highlights

Lecture 21: Mod-05 Lec-21 Design Flow considerations; Beginning a circuit design with schematic work

Lecture 22: Mod-05 Lec-22 Demo and examples of layout and routing; Technology file generation from CAD;

Lecture 23: Mod-06 Lec-23 Review of CAD output files for PCB fabrication; Photo plotting and mask generation

Lecture 24: Mod-06 Lec-24 Process flow-chart; Vias; PWB substrates

Lecture 25: Mod-06 Lec-25 Substrates continued; Video highlights; Surface preparation

Lecture 26: Mod-06 Lec-26 Photoresist and application methods,UV exposure and developing

Lecture 27: Mod-06 Lec-27 PWB etching; Resist stripping; Screen-printing technology

Lecture 28: Mod-06 Lec-28 Through-hole manufacture process steps; Panel and pattern plating methods

Lecture 29: Mod-06 Lec-29 Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs

Lecture 30: Mod-06 Lec-30 Microvia technology and Sequential build-up technology process flow for high-density

Lecture 31: Mod-06 Lec-31 Conventional Vs HDI technologies; Flexible circuits; Tutorial session

Lecture 32: Mod-07 Lec-32 SMD benefits; Design issues; Introduction to soldering

Lecture 33: Mod-07 Lec-33 Reflow and Wave Soldering methods to attach SMDs

Lecture 34: Mod-07 Lec-34 Solders; Wetting of solders; Flux and its properties; Defects in wave soldering

Lecture 35: Mod-07 Lec-35 Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures

Lecture 36: Mod-07 Lec-36 SMT failure library and Tin Whiskers

Lecture 37: Mod-07 Lec-37 Tin-lead and lead-free solders,Phase diagrams,Thermal profiles for reflow soldering

Lecture 38: Mod-07 Lec-38 Lead-free solder considerations,green electronics,RoHS compli & e-waste recycling iss

Lecture 39: Mod-08 Lec-39 Thermal Design considerations in systems packaging

Lecture 40: Mod-09 Lec-40 Introduction to embedded passives; Need for embedded passives; Design Library

Lecture 41: Mod-09 Lec-41 Embedded capacitors; Processes for embedding capacitors; Case study examples

Lecture 42: Mod-10 Lec-42 Chapter-wise summary