Metallurgy - Electronic materials, devices, and fabrication (English)

   Friday, April 25, 2025   

Starting a new Lecture Notes Series on Metallurgy - Electronic materials, devices, and fabrication

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Metallurgy - Electronic materials, devices, and fabrication By Lecture Notes together!

Lecture 1: Electronic Materials

Lecture 2: Worked numericals on week 1 lessons

Lecture 3: Optional - worked assignment on intrinsic semiconductors

Lecture 4: Semiconductors: Introduction

Lecture 5: Junction breakdown and heterojunctions

Lecture 6: Electron statistics in a solid

Lecture 7: Worked assignment on extrinsic semiconductors

Lecture 8: Intrinsic semiconductors

Lecture 9: Optional - worked assignment on metal-semiconductor junctions

Lecture 10: Intrinsic semiconductors - conductivity

Lecture 11: Worked assignment on pn junctions

Lecture 12: Extrinsic semiconductors: Introduction

Lecture 13: Worked assignment on transistors

Lecture 14: Extrinsic semiconductors - Fermi level

Lecture 15: Optional - worked assignment on optical properties

Lecture 16: Extrinsic semiconductors - mobility

Lecture 17: Worked assignment on optoelectronic devices

Lecture 18: Metal-semiconductor junctions

Lecture 19: pn junctions in equilibrium

Lecture 20: pn junctions under bias

Lecture 21: Transistors - overview

Lecture 22: MOSFETs

Lecture 23: Optoelectronic devices: Introduction

Lecture 24: Light emitting diodes

Lecture 25: Solid state semiconductor lasers

Lecture 26: Photodetectors

Lecture 27: Solar cells

Lecture 28: Mod-01 Lec-20 Semiconductor manufacturing: Introduction

Lecture 29: Mod-01 Lec-21 Si wafer manufacturing

Lecture 30: Mod-01 Lec-22 IC device manufacturing: overview

Lecture 31: Mod-01 Lec-23 Layering: thermal oxidation

Lecture 32: Mod-01 Lec-24 Doping: thermal and ion implantation

Lecture 33: Mod-01 Lec-25 Lithography

Lecture 34: Mod-01 Lec-26 Etching and deposition (growth)

Lecture 35: Mod-01 Lec-27 Metallization and polishing

Lecture 36: Mod-01 Lec-28 Process and device evaluation

Lecture 37: Mod-01 Lec-29 Productivity and process yield

Lecture 38: Mod-01 Lec-30 Clean room design and contamination control

Lecture 39: Mod-01 Lec-31 Devices and IC formation

Lecture 40: Mod-01 Lec-32 IC circuit logic and packaging